{"id":58196,"date":"2026-02-06T01:49:37","date_gmt":"2026-02-05T17:49:37","guid":{"rendered":"https:\/\/www.fst.um.edu.mo\/personal\/?page_id=58196"},"modified":"2026-02-06T21:13:50","modified_gmt":"2026-02-06T13:13:50","slug":"chenghuang","status":"publish","type":"page","link":"https:\/\/www.fst.um.edu.mo\/personal\/chenghuang\/","title":{"rendered":"chuang"},"content":{"rendered":"\t\t
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\"\"Cheng Huang<\/span><\/strong><\/span><\/p>

Associate Professor<\/span>
Email: chuang@um.edu.mo<\/span>
Phone: +853-8822-8472<\/span>
Room Number: N21-4004c<\/span><\/p>

IEEE Senior Member<\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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Bio:<\/span><\/strong><\/span><\/p>

Dr. Cheng Huang received his B.Eng and Ph.D degree from Zhejiang University and Hong Kong University of Science and Technology in 2008 and 2014, respectively. In 2014, he joined the Ishikuro Lab in Keio University, Japan, as a Project Researcher. In 2016, he was with Broadcom Ltd., San Jose, California, as a Staff Scientist. In 2018, he joined the Iowa State University, Ames, Iowa, as an Assistant Professor, where he was later promoted to Associate Professor and is now on leave of absence. He is currently at the University of Macau. His work focuses on various types of PMICs. <\/span><\/p>

He is <\/span>currently serving on the TPC of ISSCC, CICC and the ASP sub-committee of the IEEE CAS Society. In CICC, he is serving as the power sub-committee chair. He served as an Associate\/Guest Editor for TCAS-I, TCAS-II, SSC-L, and JoS. He also served as a Track Chair of ISCAS 2022 and MWSCAS 2021. He is a recipient of the NSF CAREER Award, IEEE SSC-S Outstanding Reviewer Award, and the Harpole-Pentair Young Faculty Award with named professorship.<\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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Group Photo at ISU<\/figcaption>\n\t\t\t\t\t\t\t\t\t\t<\/figure>\n\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Interest Areas<\/span><\/h3>

Various types of power management integrated circuits, including but not limited to: wireless power transfer systems, switching power regulators, energy harvesting systems, PA supply modulators, LED drivers, LiDAR supplies and drivers, charge pumps and high performance linear regulators.<\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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Highlighted Publications:<\/b><\/span><\/p>

  • Z. Li, J. Tang, N. Singh, J. Jiang, W. Zhu, X. Sun, L. Dong and C. Huang<\/strong>, “A Single-Power-Link 13.56MHz Wireless Power and Data Transfer System with Synchronized Phase-Shifted Time-Multiplexing Dual Uplinks for Implantable Voltammetry”, accepted in IEEE International Solid-State Circuits Conference (ISSCC)<\/b>,<\/i> Feb. 2026.<\/span><\/li>
  • W. Zhu, J. Jiang, X. Sun, Z. Li, T. Gu, X. Zhang and C. Huang<\/strong>, “A Single-Chip Laser Diode Driver with Built-In Frequency-Sweep Linearization for FMCW LiDAR”,\u00a0accepted in IEEE International Solid-State Circuits Conference (ISSCC)<\/b>,<\/i> Feb. 2026.<\/span><\/li>
  • X. Li, W. Peng, L. Kumar, X. Zhao, C. Huang and S. Du, “A Battery-Powered Hybrid Resonant Pulse-Train Generator with Adaptive Frequency Tracking and Residual Energy Recycling for Ultrasonic Implants”,\u00a0accepted in IEEE International Solid-State Circuits Conference (ISSCC)<\/b>,<\/i> Feb. 2026.<\/span><\/li>
  • J. Jiang, L. Zhao, J. Tang and C. Huang<\/strong>, “SLiMDO: A Single-Link Multi-Domain-Output Isolated DC-DC Converter with Passive Magnetic Flux Sharing for Local Energy Distribution and Rx Behavior Sensing-Based Global Power Modulation”, IEEE Journal of Solid-State Circuits (JSSC<\/strong>)<\/em> 2025, Early Access.<\/span><\/li>
  • J. Jiang, L. Zhao, J. Tang and C. Huang<\/strong>, “A Single-Link Multi-Domain-Output (SLiMDO) Isolated DC-DC Converter with Passive Magnetic Flux Sharing for Local Energy Distribution and Rx Behavior Sensing-Based Global Power Modulation”, accepted in IEEE International Solid-State Circuits Conference (ISSCC)<\/b>,<\/i> Feb. 2025.<\/span><\/li>
  • L. Zhao, J. Tang, X. Zhang, K. Wei, R. Magod and C. Huang<\/strong>, “A 96.1% Efficiency Single-Inductor Multiple-Output (SIMO) Buck Converter with 2.1A\/ns Transient Speed and 2.2A Maximum Current Capacity”, IEEE Journal of Solid-State Circuits (JSSC<\/strong>)<\/em> 2024, Early Access.<\/span><\/li>
  • J. Tang, L. Zhao and C. Huang<\/strong>, “A Through-Power-Link Hysteretic Controlled Capacitive Isolated DC-DC Converter with Enhanced Efficiency and Common-Mode Transient Immunity”, IEEE Journal of Solid-State Circuits (JSSC<\/strong>)<\/em> 2024, Early Access.<\/span><\/li>
  • J. Jiang, J. Tang, L. Zhao, C. Zhan and C. Huang<\/strong>, “A 63% Efficiency 1.29-W Single-Link Multiple-Output (SLiMO) Isolated DC-DC Converter Using FPC Micro-Transformer with Local Voltage and Global Power Regulations”, IEEE Journal of Solid-State Circuits (JSSC<\/strong>)<\/em> 2023, Early Access.<\/span><\/li>
  • Y. Tan, C. Huang<\/strong> and H. Ishikuro, “Design of Dual Lower-Bound Hysteresis Control in Switched-Capacitor DC-DC Converter for Optimum Efficiency and Transient Speed in Wide Loading Range for IoT Application”, IEEE Journal of Solid-State Circuits (JSSC<\/strong>)<\/em> 2023, Early Access.<\/span><\/li>
  • G. Liu, H. Wu, C. Hu, C. Huang<\/strong>, X. Liu and J. Jiang, “An 85-264Vac to 3-4.2Vdc 1.05W Capacitive Power Converter with Idle Power Reduction and 4-Phase 1\/10X SC Converter Achieving 5.11mW Quiescent Power and 78.2% Peak Efficiency”, in IEEE International Solid-State Circuits Conference\u00a0(ISSCC)<\/b><\/i> 2024.<\/span><\/li>
  • L. Zhao, J. Tang, K. Wei and C. Huang<\/strong>, “A 4-Phase\u00a0DAB Current-Mode Hysteretic Controlled Buck Converter With Relaxed Inductor Requirements and Enhanced DC and Dynamic Performance”, IEEE Journal of Solid-State Circuits (JSSC<\/strong>)<\/em> 2023, Early Access.<\/span><\/li>
  • J. Tang, L. Zhao and C. Huang<\/strong>, “A Wireless Hysteretic Controlled Wireless Power Transfer System with Enhanced Efficiency and Dynamic Response for Bioimplants”, IEEE Journal of Solid-State Circuits (JSSC<\/strong>)<\/em>, vol. 58, no. 4, pp. 1160-1171, Apr. 2023.<\/span><\/li>
  • J. Tang, L. Zhao and C. Huang<\/strong>, “A 68.5% Efficiency Reconfigurable 400-\/800-mW Capacitive Isolated DC-DC Converter with Common-Mode Transient Immunity and Fast Dynamic Response by Through-Power-Link Hysteretic Control”, in IEEE International Solid-State Circuits Conference\u00a0(ISSCC)<\/b><\/i>, Feb. 2022.<\/span><\/li>
  • J. Tang, L. Zhao and C. Huang<\/strong>, “A Wireless Power Transfer System with Up-to-20% Light-Load Efficiency Enhancement and Instant Dynamic Response by Fully Integrated Wireless Hysteretic Control for Bioimplants”, in IEEE International Solid-State Circuits Conference\u00a0(ISSCC)<\/b><\/i> 2021, pp. 470-472, Feb. 2021.<\/span><\/li>
  • C. Huang<\/b>, T. Kawajiri and H. Ishikuro, “A 13.56-MHz Wireless Power Transfer System with Enhanced Load-Transient Response and Efficiency by Fully-Integrated Wireless Constant-Idle-Time Control for Biomedical Implants”, IEEE Journal of Solid-State Circuits\u00a0(JSSC)<\/b><\/i>, vol 53, no.2, pp. 538-551, Feb. 2018.<\/span><\/li>
  • X. Liu,\u00a0C. Huang<\/b>\u00a0and P. K. T. Mok, “A High-Frequency Three-Level Buck Converter With Real-Time Calibration and Wide Output Range for Fast-DVS”,\u00a0IEEE Journal of Solid-State Circuits\u00a0(JSSC)<\/b><\/i>, vol 53, no. 2, pp. 582-595, Feb. 2018.<\/span><\/li>
  • C. Huang<\/b>, T. Kawajiri and H. Ishikuro, “A Near-Optimum 13.56 MHz CMOS Active Rectifier with Circuit-Delay Real-Time Calibrations for High-Current Biomedical Implants”,\u00a0IEEE Journal of Solid-State Circuits\u00a0(JSSC)<\/b><\/i>, vol 51, no. 8, pp. 1797-1809, Aug. 2016.<\/span><\/li>
  • C. Huang<\/b>\u00a0and P. K. T. Mok, “A 100 MHz 82.4% Efficiency Package-Bondwire Based Four-Phase Fully-Integrated Buck Converter with Flying Capacitor for Area Reduction”,\u00a0IEEE Journal of Solid-State Circuits\u00a0(JSSC)<\/b><\/i>, vol 48, no. 12, pp. 2977-2988, Dec. 2013.<\/span><\/li>
  • C. Huang<\/b>\u00a0and P. K. T. Mok, “An 84.7% Efficiency 100-MHz Package Bondwire-Based Fully Integrated Buck Converter With Precise DCM Operation and Enhanced Light-Load Efficiency”,\u00a0IEEE Journal of Solid-State Circuits\u00a0(JSSC)<\/b><\/i>, vol 48, no. 11, pp. 2595-2607, Nov. 2013.<\/span><\/li>
  • C. Huang<\/b>\u00a0and P. K. T. Mok, “An 82.4% Efficiency Package Bondwire Based Four-Phase Fully-Integrated Buck Converter with Flying Capacitor for Area Reduction”, in\u00a0IEEE International Solid-State Circuits Conference\u00a0(ISSCC)<\/b><\/i>, pp. 362-363, San Francisco, Feb. 2013.<\/span><\/li>
  • J. Jiang, Y. Lu,\u00a0C. Huang<\/b>, W.-H. Ki and P. K. T. Mok, “A 2-\/3-Phase Fully Integrated Switched-Capacitor DC-DC Converter in Bulk-CMOS for Energy-Efficient Digital Circuits With 14% Efficiency Improvement”, in\u00a0IEEE International Solid-State Circuits Conference\u00a0(ISSCC)<\/b><\/i>, pp. 366-367, San Francisco, Feb. 2015.<\/span><\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"

    Cheng Huang Associate ProfessorEmail: chuang@um.edu.moPhone: +853-8822-8472Room Number: N21-4004c IEEE Senior Member Bio: Dr. Cheng Huang received his B.Eng and Ph.D degree from Zhejiang University and Hong Kong University of Science and Technology in 2008 and 2014, respectively. In 2014, he joined the Ishikuro Lab in Keio University, Japan, as a Project Researcher. In 2016, he … <\/p>\n

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